Highlights of the day: ASE reportedly gears up for new AirPods

Apple is reportedly looking to incorporate ambient light sensors in new AirPods, with ASE Technology likely to land backend orders for packaging the ALS. ASE is poised to apply its SESUB-based packaging technology to next-generation TWS earphones.

ASE Technology likely to process ALS devices for new AirPods: Apple is expected to incorporate ambient light sensors (ALS) in next-generation AirPods devices in the coming 1-2 years, and Taiwan's ASE Technology may handle the backend process for the new component, as it has moved to purchase more packaging machines, according to industry sources.

ASE poised to apply SESUB-based SiP tech to new TWS devices: Taiwan's backend leader ASE Technology is poised to apply its SESUB (semiconductor embedded in substrate)-based SiP packaging technology to next-generation TWS (true wireless stereo) earphones to be rolled out by Apple, after being contracted to handle high-end mmWave AiP (antenna in package) process for 5G iPhones and tablets, according to industry sources.