Highlights of the day: Memory maker slows fab construction

Although the memory market looks to be heading towards a recovery in 2020, suppliers are cautious about expanding supply. Winbond is building a new plant in Kaohsiung, southern Taiwan, with completion originally slated for year-end 2020 and commerical production for 2021. But now the company has now rescheduled equipment move-in to January 2022. Meanwhile, ASE reportedly is the one providing semiconductor backend services for packaging Qualcomm's freshly launched Arm-based processors for notebooks.

Winbond slowing down new fab construction: Specialty DRAM and flash memory chipmaker Winbond Electronics is slowing down constructing and equipping its new 12-inch wafer plant in Kaohsiung, southern Taiwan, according to company chairman Arthur Chiao.

ASE reportedly grabs SiP orders for new Qualcomm PC processor: Qualcomm has launched new Arm-based processors for notebooks. Among the chips, the new Snapdragon 7c series designed for entry-level devices reportedly adopts ASE Technology's system-in-package (SiP) services to integrate multiple chips into one single package to help OEMs lower their R&D costs.