MediaTek may supply Samsung with 5G chips for low-end smartphones - Gizmochina
MediaTek may supply Samsung with 5G chips for low-end smartphones
By
Sean
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Dec 9, 2019
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According to a new report, MediaTek might be supplying Samsung with 5G chipsets for its low-end range of smartphones in the near future. The former has already formed partnerships with various other brands like Oppo, Vivo, and Xiaomi and may now also supply the South Korean tech giant for its affordable range of smartphones.
MediaTek has just recently launched its Dimensity 1000 which is a high-end 5G SoC. It will be seen in various smartphones from the aforementioned brands in 2020. Alongside this, the company has also announced two mid-range 5G SoC with designated model numbers MT6885 and MT6873 which may soon be found in Samsung’s low-end handsets as well. Notably, MediaTek chipsets are also expected to be featured in Huawei’s affordable lineup of smartphones in 2020.
Reportedly, Samsung is currently in contact with MediaTek for the introduction of mainstream and affordable 5G smartphone chips in the Samsung Galaxy A series and other low-end models. With two of the most popular smartphone brands partnering up with MediaTek, the shipments of the company’s new 5G SoC are expected to reach record-breaking levels.
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Furthermore, Samsung has closed its ODM (Original Design Manufacturer) factory in Mainland China and is seeking to outsource low to medium segment devices to others. This provides an opportunity for companies like MediaTek that can receive large sums of orders for Samsung’s affordable range of smartphones.
MediaTek is one of the leading companies for 5G networking in terms of mobile chipsets. Its latest modems also support most of the current global telecommunication operator’s specifications as well. This makes it a key player in the global markets for 5G bandwidths. Additionally, MediaTek is also developing a more advanced millimeter ware (mmWave) frequency band, which will be faster than current 5G solutions and is expected to arrive by 2021.
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